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Inari Amertron Berhad (0166.KL)

Kuala Lumpur - Kuala Lumpur Precio retrasado. Divisa en MYR.
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3.2000+0.0200 (+0.63%)
A partir del 12:28PM MYT. Mercado abierto.

Inari Amertron Berhad

D-07-03, Plaza Kelana Jaya
Jalan SS 7/13A Kelana Jaya
Petaling Jaya 47301
Malaysia
60 3 7876 0169
https://www.inari-amertron.com

Sector(es)Technology
IndustriaSemiconductor Equipment & Materials
Empleados a tiempo completo

Ejecutivos clave

NombreTítuloPagarEjecutadoAño de nacimiento
Mr. Kean Cheong LauGroup CEO & Executive DirectorN/DN/D1967
Dr. Seng Chuan TanExecutive Vice ChairmanN/DN/D1955
Mr. Gian Kui WongExecutive Director810kN/D1960
Mr. Phon Guan HoExecutive DirectorN/DN/D1955
Mr. Mang Lee MaiExecutive DirectorN/DN/D1959
Ms. Poh Leng ChongGroup Chief Financial OfficerN/DN/D1970
Mr. Bin Samsuri SabranHead of Business Unit - Inari Technology Sdn BhdN/DN/D1965
Mr. Kar Leong KhooSenior Vice President of Inari Integrated Systems Sdn BhdN/DN/D1970
Mr. Kha Choy FooHead of Business Unit - Amertron Technology (Kunshan) Co. LtdN/DN/DN/D
Mr. Choon Meng PangHead of Business Unit of Amertron IncorporatedN/DN/DN/D
Los importes son a partir de 31 de diciembre de 2023 y los valores de compensación son para el último año fiscal que finaliza en esa fecha. Pago corresponde al salario, las bonificaciones, etc. Ejecutado corresponde al valor de las opciones ejecutadas durante el año fiscal. Divisa en MYR.

Descripción

Inari Amertron Berhad, an investment holding company, engages in the provision of electronic manufacturing, outsourced semiconductor assembly, and testing services for radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies in Malaysia, Singapore, the United States, China, the Philippines, and internationally. The company offers wafer processing services covering bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection; and chip fabrication and wafer certification in fiber optic chips, such as wafer scribe and cleave, bar aligning, demount-load fixtures and facet coating, and chip on carrier. It also provides advanced system in package assembly and test services, including fine-pitch surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill, and post-mold oxide plating and final testing, as well as finial testing of advanced communication chips; and other services, such as new product introduction services, failure analysis lab, sensor and IC package design and characterization, process customization and assembly, product testing, box build, and direct-to-end-customer dropship services. In addition, the company manufactures electronics optical fiber and optoelectronics devices, communication chips, and die preparations, as well as offers manufactures, assembles, and tests optoelectronic and sensor components, modules, and systems; designs, develops, and manufactures fiber optic products; designs, assembles, and supplies semiconductor manufacturing process tools, as well as customized semiconductor process tools and parts; and invests in properties. Inari Amertron Berhad was founded in 2006 and is based in Petaling Jaya, Malaysia.

Gestión corporativa

La calificación ISS Governance QuickScore de Inari Amertron Berhad a partir del N/D es N/D. Las puntuaciones principales son Auditoría: N/D; Junta: N/D; Derechos del accionista: N/D; Compensación: N/D.

Las puntuaciones de la gestión corporativa son cortesía de Servicios de accionistas institucionales (ISS). Las puntuaciones indican una posición decil en relación con el índice o la región. Una puntuación decil 1 indica que el riesgo de gestión es menor, mientras que una puntuación decil 10 indica que el riesgo de gestión es mayor.